On November 6, 2025, the sub-forum on "Engineering Electrostatic Protection and Emerging Industry Applications" under the New Industry Leading Standardization Forum was held in Shanghai 

under the theme "Integration & Leap: Engineering Electrostatic Protection Paving the Way for Emerging Industries."

The event was attended by prominent figures including Shi Huikang, Chair of the Electrostatic Standardization Technical Committee and Deputy Director-General of the Electronic Information 

Department of the Ministry of Industry and Information Technology; Guo Nan, Vice Chair of the Committee and Vice President of the China Electronics Standardization Institute; Sun Keping, 

Committee Advisor and Professor at Shanghai Maritime University; and Sun Yanlin, Vice Chair of the Committee and Director of the Technical Committee of the Anti-Static Equipment Branch 

of China Electronic Instrument Industry Association.

Over a hundred representatives from enterprises, research institutes, industry associations, and media in the field of engineering electrostatic protection gathered to discuss pathways for the 

development of electrostatic standardization.